Shengjie Manufacture Price Heat Insulation Low Thermal Nano Insulation Board
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Product Details
| Customization: | Available |
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| Model No: | Insulating Material |
| Working Temperature: | Common (1580°< Refractoriness< 1770° |
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Basic Info.
- Model NO.
- Nano-550
- Brand Name
- Shengjie
- Application
- Furnace Lining
- Transport Package
- Polywooden Case
- Specification
- 100*100*100cm
- Trademark
- Shengjie
- Origin
- China
- HS Code
- 6808000000
- Production Capacity
- 100000ton Per Year
Product Description
Nano Insulation Board
The main components of the microporous board is nano silicon dioxide and silicon carbide. It is a new type of heat insulation material obtained after a series of physical and chemical reactions, consisting of silicon dioxide particles with diameters of tens of nanometers, and infrared sunscreens and fibers. It is also called nano-board, nano-insulation board, nano-insulation board, thermal insulation material, nano-composite insulation board, nano-aerogel, nano-microporous thermal insulation material, etc. The thermal insulation performance of microporous board is lower than that of still air, which can greatly reduce the energy consumption of equipment and reduce the thickness of the required thermal insulation layer.
Technical datas:
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Density
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230-280kg/m3
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Color
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Gray, Blue
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Classification Temperature
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850/1000/1100/1200ºC
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Specifications
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1000*600mm, 900*500mm
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Thickness
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5-50mm
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Packing Method
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Carton, Wooden Box, Pallet
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Item
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SK950
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SK1000
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SK1100
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Melting Point (ºC)
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≥1200
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≥1200
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≥1200
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Operating Temperature (ºC)
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950
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1000
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1100
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Density (kg/m³)
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280-350
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550-650
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550-650
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Compressive strength (MPa)
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0.5
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0.8-1.2
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0.8-1.2
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Heating wire shrink 800ºC (%)
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≤1.9
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≤1.9
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≤1.9
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Thermal Conductivity(w/m.k) |
200ºC
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0.016
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/
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/
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400ºC
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0.021
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0.043
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0.047
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600ºC
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0.026
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0.057
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0.058
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800ºC
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0.035
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0.063
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0.069
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Applications:1. Industrial Furnaces and Kilns: Enhance energy efficiency and temperature control.
2. Transportation: Insulate vehicles and equipment for thermal management.
3. Building Construction: Improve insulation in walls, roofs, and floors.
4. Appliances: Enhance efficiency in ovens, refrigerators, and HVAC systems.
5. Electronics: Thermal management in electronics manufacturing.
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Packing & Delivery